PLANERLITE
The PLANERLITE is a polishing material used in chemical mechanical planerlization (CMP) technology which has been incorporated into the planarization process for high-density ULSI devices.
Features
- It has been developed under the basic concepts of high purity, high removal rate, high dispersion and scratchfree performance.
Applications
- Polishing for Si02 films (interlayer dielectric, STI), poly-Si, Cu interconnection, etc.
