Grinding wheels for compound semiconductor wafers
These wheels are used in the thinning and thickening process of wafers, including SiC wafers, which have become indispensable for power devices in recent years.
Grinding wheel
Features
We can propose the most suitable wheel to match the specifications of your processing machine.
By combining vitrified bonds with an optimal diamond and controlled pore structure, a high-quality grinding surface can be achieved.
