This is polishing pads for semiconductor wafers. We offer a lineup of pads for pr...
This is a beveling wheel for various semiconductor substrates and is used in the ...
This is a notch wheel for various semiconductor substrates and is used in the waf...
These wheels are used in the thinning and thickening process of wafers, including...
TRINC has been developing equipment for foreign object countermeasures in order t...
Realize the environment where dust does not adhere to the objects by eliminating ...
When used waste solvent is placed in the tank, it can be returned to clean liquid...
Achieved more than 99 % elimination efficiency with VOC Gas Recovery Device REART...
By setting the workpiece in the carrier hole between the upper and lower surface ...
This is a machine that polishes silicon wafers, etc. mounted on the base plate wi...
New common sense!! Low reflection process that is neither thin film nor coating. ...
It has been introduced into a wide range of industrial fields, from the aerospace...
This is a paste-like abrasive for hand polishing, mixed with diamond powder and s...
Batch type and continuous formic acid vacuum reflow unit are available. N2 vacuum...
SHOROX is CeO2 abrasive for finishing various glass materials including optical g...
This is a slurry-like abrasive material mixed with diamond powder and special gri...
・Maintains lapping plate flatness sustainably without flatness deviation problem...
This is a equipment that automatically transports, packs, and unpacks 8 and 12 in...
"zero" dust revolution TRINC has focused attention on the fundamental q...
This is a pressurizing device that supports new applications with various combina...