WA is a fused White Alumina abrasive powder. It is a typical fine powder for prec...
POLIPLA is a compound-type polishing slurry developed especially for plastic lens...
The PLANERLITE is a polishing material used in chemical mechanical planerlization...
With the increasing integration of semiconductor devices and the larger size of w...
GC, green silicon carbide, is a very high purity SiC lapping powder. Features The...
FZ is composed of ultra-fine zirconium oxide particles, and is optimum for polishi...
FO is an alumina based precision lapping powder that uses carefully selected mate...
FM is a final polishing material for a wide variety of metals, ranging from high s...
FAL is a high-purity calcining alum. Features The crystal particles obtained unde...
COMPOL is a colloidal silica slurry developed especially for polishing electronic...
CLEALITE is a polishing slurry for all kinds of metals, including copper, aluminu...
CEPOL is Cerium Oxide Polishing Material manufactured by Fellow, Inc. in the U.S....
SHOROX is CeO2 abrasive for finishing various glass materials including optical g...