Edge Polishing System
The best-selling series of silicon wafer edge polishing machines with their excellent track record.
With the polishing station divided into four, these machines combine high stability, high productivity, and space-saving design. Five types are currently available: the 4-inch, 6-inch, 8-inch, 6/8-inch convertible and 12-inch types. We also respond to requests for customization.
It is also possible to polish edges of brittle materials such as silicon, sapphire, silicon carbide, and lithium tantalite.
Features
- Achieves high efficiency and low stress polishing to WF by separating the process stage for each part.
- Wide contact area between polishing pad and WF edge to support high efficiency.
- By using centrifugal force for the polishing pressure, it is possible to polish without breaking the edge shape precisely formed by the edge grinder (centrifugal force following processing method).
