Double-side polishing machine

By setting the workpiece in the carrier hole between the upper and lower surface plates and polishing it with various types of free abrasive grains, it is possible to remove the minute layers of processing strain generated by lapping and other processes to obtain a smooth surface.


  1. The lower surface plate, upper surface plate, sun gear, and internal gear are driven individually, so the rotation speed can be set more optimally.
  2. A continuously variable transmission selects the appropriate speed for the workpiece.
  3. By installing a spring mechanism (patented) in the upper surface plate suspension, the shock at the time of plate landing is softened and the load is transmitted smoothly.


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