Vacuum reflow unit
Batch type and continuous formic acid vacuum reflow unit are available.
N2 vacuum reflow unit and plasma reflow unit for bump formation are also available.
Continuous formic acid vacuum reflow unit
Batch-type formic acid vacuum reflow unit
Plasma reflow unit
Features
- This unit melts solder under vacuum to remove voids from the solder.
- Flux-free soldering is realized by preheating in an formic acid or hydrogen reduction atmosphere.
- High quality soldering can be achieved with our unique temperature control and vacuum control capabilities.
- There are many achievements in manufacture power devices and form bumps for flip chip bonding.
